请问下面两种测试有何不同，如何操作
Terminal strength for SMD device: Solder part to PC board using all of the solder procedure. From the opposite of the test board, apply a 1.8Kg force through a hole to the center of the part body, perpendicular to the seating plane for 60 seconds.
Board adhesion (push test): Solder part on a FP4, place the force gauge low, in parallel with the test board, at the center of the components body, and opposite its terminations. slowly push with increasing force till to 4500g or failure occur.
具体是从什么位置，方向加力 |
发表于 2012-5-18 00:02:30
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