小弟初来咋到,听大家多多指点,作为一个SQA对TE的分析报告只要做到以下几点我想可能会更懂一些吧!
IC FA primary report format
1. Issue Background and description.
2. Condition
3. Compare OK and NG test read data
4. Swap test
Attachment (lead/ball less than 48 IC: LPCC BGA QFP)
a. According to IC diagram find GND location, use multimeter to respectively test OK and NG material.
b. contrast data
5. Summary
1. Issue Background and description.
State lot code/date code/defect rate( including input total how
many find defects? dosage big or small per day? if happen
before this time.
2. Condition
(1) No standard equipment to identify, so only pass defective phenomenon to judge defect.
(2) a: Inspect appearance and give five defects mark number.
Carefully inspect appearance under 10x magnifier then mark number on inverse.
b: do x-ray observe their wire if sweep or open?
c: check all interrelated ESD, including operation tact and static desk and equipment in production line.
Record inspect result and test data which including machine/equipment/
operation platform contrast to our spec.
3. Compare OK and NG test read data
a: respectively get data from test program.
b: find OK and NG variation
c: conclusion
4. Swap test (Use illustration mark fail item)
a: result A
b: Result B.
c. Contrast A and B result
c.1.Different board test result is same, show that the board can’t influence IC .
c.2.Different board test result is different, show that the different board can influence IC,
The issue may be board Matching issue.