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论作为TE分析IC的初步报的基本格式

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1#
发表于 2011-11-4 22:14:42 | 只看该作者 回帖奖励 |正序浏览 |阅读模式
本来IC分析起来是很复杂的,但是我发现很多电子厂的TE真的好拉级,即使没有专用的测试设备分析也不至于分析报告就几句话完了,平常人根本一点也看不懂!

小弟初来咋到,听大家多多指点,作为一个SQA对TE的分析报告只要做到以下几点我想可能会更懂一些吧!
IC FA primary report format
1. Issue Background and description.
2. Condition
3. Compare OK and NG test read data
4. Swap test
Attachment (lead/ball less than 48 IC: LPCC BGA QFP)
a. According to IC diagram find GND location, use multimeter to respectively test OK and NG material.
b. contrast data
5. Summary
1. Issue Background and description.
State lot code/date code/defect rate( including input total how
many find defects? dosage big or small per day? if happen
before this time.
2. Condition
(1) No standard equipment to identify, so only pass defective phenomenon to judge defect.

(2) a: Inspect appearance and give five defects mark number.
Carefully inspect appearance under 10x magnifier then mark number on inverse.
b: do x-ray observe their wire if sweep or open?
c: check all interrelated ESD, including operation tact and static desk and equipment in production line.
Record inspect result and test data which including machine/equipment/
operation platform contrast to our spec.
3. Compare OK and NG test read data
a: respectively get data from test program.
b: find OK and NG variation
c: conclusion
4. Swap test (Use illustration mark fail item)
a: result A
b: Result B.
c. Contrast A and B result
c.1.Different board test result is same, show that the board can’t influence IC .

c.2.Different board test result is different, show that the different board can influence IC,
The issue may be board Matching issue.

5. summary
Acquire conclusion form 2./3./4.
7#
 楼主| 发表于 2011-11-4 22:15:17 | 只看该作者
不过,平常都是ESD问题或EOS,真正有问题的不良真是太少,这样就只能老和产线在那扯皮了.
6#
发表于 2011-11-4 22:15:11 | 只看该作者
我們一般都請供應商協助分析,除非真正弄清了是IC的問題才會去投訴供應商!
5#
 楼主| 发表于 2011-11-4 22:15:05 | 只看该作者
不过说来那些TE只会测试,报告真的太烂,他们就几句话完了,我说那也叫报告,真晕了!
4#
发表于 2011-11-4 22:15:00 | 只看该作者
请勿用英语,
3#
发表于 2011-11-4 22:14:53 | 只看该作者
呵呵,看来楼主是SQE之类的了,TE倒了几下,证明是IC问题,一脚把问题飞到SQE,SQE找供应商,人家肯定是要你提供报告的嘛,那可是要退货赔钱!

比如你工厂的ESD,环境,凭什么就一定是IC来料问题,不可是你测试参数弄错,或者自己烧坏了,说是我来料不对拿文件来.是ESD问题还是EOS造成呢?理由多了去了,

要像我们工厂的QE学习,TE说是IC问题,QE决对地要他们拿出证据来,一来二去,就不了了之,QE也不用麻烦的了.

不过我们是多头管理,个个都是爷,早晚完蛋的厂.
2#
发表于 2011-11-4 22:14:47 | 只看该作者
我這里有IC廠商分析的報告,但是還不知道如何上傳!
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