SMIA 可靠度规范
SMIA 1.0 Part 6:Reliability Specification
1. Overview.......8
1.1 Objective.......8
1.2 Scope of Application.....8
2. General Requirements..8
2.1 Performance Measurements.8
2.2 Standard Measurement Environment...8
2.3 Measurement System Analysis.....8
2.4 Test Data Availability....9
2.5 Requalification Requirements.......9
3. Test Classification......10
3.1 Lot Acceptance Tests (Group A).10
3.2 Reliability Monitoring Tests (Group B)10
3.3 Research & Development Level Tests (Group C).......10
3.4 Mechanical Tests for Connection Systems (Group D)10
3.5 Tests for Changes.......11
4. Test Requirements......11
4.1 Group A Tests (Lot Acceptance Tests for camera module)11
4.1.1 A1, Electrical Characteristics.......11
4.1.2 A2, Mechanical Characteristics...11
4.1.3 A3, Optical Characteristics..11
4.1.4 A4, Shipping Packages and Labels.....11
4.2 Group B Tests (Reliability Monitoring Tests for camera module).......11
4.2.1 B1, High Temperature Operating Life Test / Early Life Failure Rate Estimation.11
4.2.2 B2, Temperature & Humidity Stress Test....12
4.2.3 B2.3 Mechanical Impact Tests....14
4.3 Group C Tests (R&D Tests for camera module).15
4.3.1 C1: Do B1 Test Again..15
4.3.2 C2: Combination Test; Test B2 + (B2.2 and B2.3)......15
4.3.3 C3: High Temperature.15
4.3.4 C4; Random Vibration.15
4.3.5 C5: Latch Up Test16
4.3.6 C6 Steady State Temperature Humidity Bias Life Test.......16
4.3.7 C7 High Temperature Operating Life Test..17
4.3.8 C8 Low Temperature Operating Life Test...17
4.3.9 C9 Solar Radiation Test......17
4.4 Group D Tests: Mechanical Tests for Connection Systems (Connectors & FPC)......18
4.4.1 D1 Vibration Tests.......18
4.4.2 D2 Pull-Out Test (Camera Module from the Socket In case Applicable)....19
4.4.3 D3 Peel-Out Test of the FPC (in Case Applicable).....19
4.4.4 D4 Module Insertion Test....19
4.4.5 D5 Flex Bending Test..19
4.4.6 D6 Connector Quality Check.......19
4.4.7 D7 Mechanical Impact Tests.......20
5. References...21
5.1 IEC Standards....21
5.2 JEDEC Standards......21
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